Ceramic substrates and packages for electronic applications </titleInfo> <name type="personal"> <namePart>International Symposium on Ceramic Substrates and Packages</namePart> <role> <roleTerm type="text" authority="marcrelator">creator</roleTerm> </role> </name> <name type="personal"> <namePart>Yan, Man F.</namePart> <role> <roleTerm type="text" authority="marcrelator">creator</roleTerm> </role> </name> <name type="personal"> <namePart>American Ceramic Society. Electronics Division. Fall Meeting</namePart> <role> <roleTerm type="text" authority="marcrelator">creator</roleTerm> </role> </name> <name type="corporate"> <namePart>日本セラミックス協会</namePart> <role> <roleTerm type="text" authority="marcrelator">creator</roleTerm> </role> </name> <typeOfResource>text</typeOfResource> <originInfo> <publisher>American Ceramic Society</publisher> <dateIssued/> <frequency>unknown</frequency> </originInfo> <language> <languageTerm authority="iso639-2b" type="code">eng</languageTerm> </language> <physicalDescription> <form authority="marcform">volume</form> <extent>xi, 608 p. ; 25 cm</extent> </physicalDescription> <subject> </subject> <classification authority="udc">666.6</classification> <abstract/> <note>"Proceedings of the International Symposium on Ceramic Substrates and Packages, sponsored by the Electronics Division of the American Ceramic Society and the Ceramic Society of Japan, held in Denver, CO, on October 18-21, 1987"--T.p. verso//Includes bibliographical references</note> <identifier type="isbn">9780916094355</identifier> <recordInfo> <recordCreationDate>2000-12-26 03:52:35 +0900</recordCreationDate> <recordChangeDate>2025-12-15 09:47:36 +0900</recordChangeDate> <recordIdentifier>https://library.nims.go.jp/manifestations/5011</recordIdentifier> </recordInfo> </modsCollection>