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<titleInfo>
  <title>半導体材料工学 : 材料とデバイスをつなぐ</title>
</titleInfo>
<titleInfo type="alternative">
  <title></title>
</titleInfo>
<name type="personal">
  <namePart>大貫, 仁</namePart>
  <role>
    <roleTerm type="text" authority="marcrelator">creator</roleTerm>
  </role>
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<originInfo>
  <publisher>内田老鶴圃</publisher>
  <dateIssued/>
  <frequency>unknown</frequency>
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<language>
  <languageTerm authority="iso639-2b" type="code">jpn</languageTerm>
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<physicalDescription>
  <form authority="marcform">volume</form>
  <extent>ix, 263p ; 21cm</extent>
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<subject>
</subject>
<classification authority="udc">621.3</classification>
<abstract/>
<note>参考文献: 各章末</note>
<identifier type="isbn">9784753656233</identifier>
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  <recordCreationDate>2013-03-21 15:48:14 +0900</recordCreationDate>
  <recordChangeDate>2026-03-19 14:46:17 +0900</recordChangeDate>
  <recordIdentifier>https://library.nims.go.jp/manifestations/100802</recordIdentifier>
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