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Materials, Integration and Packaging Issues for High-Frequency Devices 2 : Symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A. ; MRS Vol.833 Vol.833 Vol.883
editors；Yong S. Cho, Don Shiffler, Clive A. Randall [et al.]
Materials Research Society (MRS)
(2005)
UDC: MRS
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