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BGA Joint Microstructure of Sn-Ag Based Solders with Au/Ni-P Plating 
Creator: Uenishi, Keisuke Sakatani, Shigeaki Yamamoto, Takashi Kobayashi, Kojiro F. Contributor: Okamoto, Ｋ. Kita, Hidetoshi Nakayama, Noriaki Yamamoto, Setsuo Higa, Mitsuru Ohshima, Naoki Ioku, Koji Hashimo, Kazuhiko Schmidt, Helmu Ohtaki, Michitaka Terasaki, Ichiro Kajitani, Tsuyoshi Funahashi, Ryoji Akashi, Mitsuru Suda, Yasuo Aoyagi, Takao Taguchi, Takahisa Ohgushi, Hajime Tanaka, Junzo Yamashita, Kimihiro Kobayashi, Hisatoshi TaniguiroKirihara, Akiyoshi
(Date of publication: 2004)
https://hdl.handle.net/20.500.11932/1263548 
Manifestation: BGA Joint Microstructure of Sn-Ag Based Solders with Au/Ni-P Plating
Checkout type: 標準
Circulation status: Available On Shelf
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Created at: Mon, 31 Jul 2023 14:50:59 +0900
Updated at: Mon, 31 Jul 2023 14:50:59 +0900
