[M] Materials, integration and packaging issues for high-frequency devices [1]

Creator: Materials Research Society Publisher: Materials Research Society (Date of publication: 2004)

Manifestation: Materials, integration and packaging issues for high-frequency devices [1]

Shelf: Journal Archives 60 (Namiki)

Checkout type: 標準

Circulation status: Available On Shelf

Call number: MRS|P|783

Register number:

Item identifier: 219607

Include supplements: No

Required role: Guest

Acquired at: June 08, 2004

Note:

Accepted at:

Created at: Thu, 16 Dec 2010 00:01:41 +0900

Updated at: Wed, 03 Dec 2025 16:34:55 +0900