[M] Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead Free Alloy　under Heat Exposure Condition

Creator: Shoj, Ikuo Tsunoda, Satoshi Watanabe, Hirohiko Asai, Tatsuhiko Nagano, Megumi (Date of publication: 2005)
https://hdl.handle.net/20.500.11932/1465017

Manifestation: Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead Free Alloy　under Heat Exposure Condition

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Created at: Mon, 31 Jul 2023 14:11:17 +0900

Updated at: Mon, 31 Jul 2023 14:11:17 +0900