[M] Influence of an Immersion Gold Planting Layer　on Reliability of a Lead-Free Solder Joint

Creator: Shohji, Ikuo Goto, Hiroki Nakamura, Kiyotomo Ookubo, Toshikazu (Date of publication: 2005)
https://hdl.handle.net/20.500.11932/1465013

Manifestation: Influence of an Immersion Gold Planting Layer　on Reliability of a Lead-Free Solder Joint

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Created at: Mon, 31 Jul 2023 14:19:11 +0900

Updated at: Mon, 31 Jul 2023 14:19:11 +0900