[M] Composition and Heat-Treatment　Effects on the Adhesion Strength of　Sn-Zn-AI Solders on Cu Substrate

Creator: Pu Yu Shan Wang Hsin-Chien Hon Min-Hsiung Wang Moo-Chin (Date of publication: 2000-06)
https://hdl.handle.net/20.500.11932/555551

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Collection:	元素戦略ライブラリー
Form:	Volume
Language:	unknown
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Identifier:	Handle URI: https://hdl.handle.net/20.500.11932/555551
Full-text file	Composition_and_Heat-Treatment_Effects_on_the_Adhesion_Strength_of_Sn-Zn-Al_Solders_on_Cu_SubstrateOCR.pdf (4.58 MB) NIMS Read Only License: Prohibit Commercial Use (NIMS only)
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