[M] BGA Joint Microstructure of Sn-Ag Based Solders with　Au/Ni-P Plating

Creator: Uenishi, Keisuke Sakatani, Shigeaki Yamamoto, Takashi Kobayashi, Kojiro F. Contributor: Okamoto, Ｋ. Kita, Hidetoshi Nakayama, Noriaki Yamamoto, Setsuo Higa, Mitsuru Ohshima, Naoki Ioku, Koji Hashimo, Kazuhiko Schmidt, Helmu Ohtaki, Michitaka Terasaki, Ichiro Kajitani, Tsuyoshi Funahashi, Ryoji Akashi, Mitsuru Suda, Yasuo Aoyagi, Takao Taguchi, Takahisa Ohgushi, Hajime Tanaka, Junzo Yamashita, Kimihiro Kobayashi, Hisatoshi TaniguiroKirihara, Akiyoshi (Date of publication: 2004)
https://hdl.handle.net/20.500.11932/1263548

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Collection:	元素戦略ライブラリー
Form:	Volume
Language:	unknown
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Identifier:	Handle URI: https://hdl.handle.net/20.500.11932/1263548
Full-text file	Transactions_of_the_Materials_Research_Society_of_JapanNo5_OCR_58.pdf (0.48 MB) NIMS Read Only License: Prohibit Commercial Use (NIMS only)
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