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Materials, Integration and Packaging Issues for High-Frequency Devices : Symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. ; MRS Vol.783 Vol.783 Vol.783 
Creator: editors；P. Muralt, Y.S. Cho, M. Klee, J-P. Maria [et al.] Publisher: Materials Research Society (MRS)
(Date of publication: 2004)
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| Number: | Volume number: Vol.783 |
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Volume
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| Language: | English |
| Physical description: | 232p; 24cm |
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| Identifier: | ISBN: 9781558997219 |
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| Item identifier | Library | Shelf | Call number | Circulation status |
|---|---|---|---|---|
| 219607 | Sengen |
Proceedings 26 
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MRS|P|11988 | Available On Shelf |