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Proceedings, creep & fracture high temperature components - design & life assessment issues : ECCC Creep Conference, September 12-14, 2005, London, UK
edited by I. A. Shibli, S. R. Holdsworth, G. Merckling ; organised by European Creep Collaborative Committee
Creator: ECCC Creep Conference European Creep Collaborative Committee Shibli, I. A. Holdsworth, S. R. Merckling, G. Contributor: edited by I.A. Shibli, S.R. Holdsworth, G. Merckling; organized by European Creep Collaborative Committee, sponsored by SIEMENS ALSTOM Publisher: DEStech Publications (Date of publication: 2005)
Checkout type: 標準
Circulation status: Available On Shelf
Call number: 539.4|S|キ1395
Register number:
Item identifier: 219971
Include supplements: No
Required role: Guest
Acquired at: March 13, 2006
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Accepted at:
Created at: Thu, 16 Dec 2010 02:23:50 +0900
Updated at: Mon, 15 Dec 2025 09:33:48 +0900