[M] 半導体材料工学 : 材料とデバイスをつなぐ

大貫仁著
Creator: 大貫, 仁 Publisher: 内田老鶴圃 (Date of publication: 2004-11)

• Detail

Series statement:	材料学シリーズ
Form:	Volume
Language:	Japanese
Physical description:	ix, 263p ; 21cm
Subject:
Classification:	UDC: 621.3
Tag:
Identifier:	ISBN: 9784753656233 NCID: BA69460883
Abstract:
Note:	参考文献: 各章末

Item identifier	Library	Shelf	Call number	Circulation status
600072	Namiki	Books 21	621.3|O	Available On Shelf

• Reserve this manifestation
  (0 users)