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[M] Bonding in Microsystem Technology Vol.24 24 冊子体

Creator: Publisher: Springer (Date of publication: 2006)

Series statement:
  • Springer Series in Advanced Microelectronics
Edition:
Number: Volume number: 24
Form: 冊子体 冊子体
Language: English
Physical description: 331p; 25cm
Subject:
Classification:
Identifier: ISBN: 9781402045783
Abstract:

Note:

Item identifier Library Shelf Call number Circulation status
210909 Sengen Books 5 Picture 539.24|D|キ1527 Available On Shelf