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[M] Materials, Integration and Packaging Issues for High-Frequency Devices 2 : Symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A. ; MRS Vol.833 Vol.833 Vol.883 冊子体

Creator: Publisher: Materials Research Society (MRS) (Date of publication: 2005)

Edition:
Number: Volume number: Vol.883
Form: 冊子体 冊子体
言語: English
Physical description: 270p; 24cm
Subject:
Classification:
Identifier: ISBN: 9781558997813
Abstract:

Item identifier Library Shelf Call number Circulation status
219756 Sengen Proceedings 26 Picture MRS|P|12109 Available On Shelf