[M] Proceedings : Creep & Fracture in High Temperature Components : Design & Life Assessment Issues: ECCC Creep Conference September 12-14, 2005 London, UK

Creator: edited by I.A. Shibli, S.R. Holdsworth, G. Merckling; organized by European Creep Collaborative Committee, sponsored by SIEMENS ALSTOM Contributor: edited by I.A. Shibli, S.R. Holdsworth, G. Merckling; organized by European Creep Collaborative Committee, sponsored by SIEMENS ALSTOM Publisher: DEStech publications (Date of publication: 2005)

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Form:	Volume
Language:	English
Physical description:	1115p; 26cm
Subject:
Classification:	UDC: 539.4
Tag:
Identifier:	ISBN: 9781932078497
Abstract:
Note:

Item identifier	Library	Shelf	Call number	Circulation status
219971	Sengen	Books 6	539.4|S|ｷ1395	Available On Shelf

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