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Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. 
editors, Ting Y. Tsui ... [et al.]
Creator: Materials, Technology and Reliability of Low-k Dielectrics and Cooper Interconnects Tsui, Ting Y. Publisher: Materials Research Society (Date of publication: 2006)
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Volume
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| Language: | English |
| Physical description: | xvii, 462 p. ; 24 cm |
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NCID: BA78618898
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"... Symposium F, "Materials, Technology and Reliability of Low-k Dielectrics and Cooper Interconnects," held April 18-21 at the 2006 MRS Spring Meeting in San Francisco, California ..."--Pref//Includes bibliographical references and indexes |
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| Item identifier | Library | Shelf | Call number | Circulation status |
|---|---|---|---|---|
| 210818 | Namiki |
Journal Archives 60 
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MRS|P|914 | Available On Shelf |
