[M] Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

editors, Ting Y. Tsui ... [et al.]
Creator: Materials, Technology and Reliability of Low-k Dielectrics and Cooper Interconnects Tsui, Ting Y. Publisher: Materials Research Society (Date of publication: 2006)

Manifestation: Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

Shelf: Journal Archives 60 (Namiki)

Checkout type: 標準

Circulation status: Available On Shelf

Call number: MRS|P|914

Register number:

Item identifier: 210818

Include supplements: No

Required role: Guest

Acquired at: October 02, 2006

Note:

Accepted at:

Created at: Thu, 16 Dec 2010 02:24:55 +0900

Updated at: Wed, 03 Dec 2025 16:35:05 +0900