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[M] Proceedings of The Third International Symposium on Electronic Packaging Technology August 17-21, 1998 Beijing, China (ISEPT'98)
Creator: editors: Keyun Bi, Shouwen Yu, Sheng Liu [et al.] Publisher: Tsinghua University Press
(Date of publication: 1998)
Form: | Volume |
Language: | English |
Physical description: | 603p; 26cm |
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