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Proceedings of The Third International Symposium on Electronic Packaging Technology August 17-21, 1998 Beijing, China (ISEPT'98)
Creator:
editors: Keyun Bi, Shouwen Yu, Sheng Liu [et al.] Publisher:
Tsinghua University Press
(Date of publication:
1998-01-01)
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| Language: | English |
| Physical description: | 603p; 26cm |
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